PowerEdge R670 Rack Server

Technical Specifications

Processor

• Two Intel® Xeon® 6 Processors

• Up to 144 E-cores or 86 P-cores per processor

Memory

• 32 x DDR5 DIMM slots

• Up to 8 TB RDIMM

• Speeds up to 6400 MT/s

• Supports registered ECC DDR5 DIMMs only

Storage Controllers

• Internal Boot Options:

  • Boot Optimized Storage Subsystem (BOSS-N1 DC-MHS) with HW RAID 1: 2 x M.2 NVMe SSDs

  • M.2 Interposer board (DC-MHS): 2 x M.2 NVMe SSDs

  • USB

• Internal Controllers:

  • Front PERC H965i

  • Front PERC H975i

  • Front PERC H365i

Drive Bays

• No Backplane Configuration

• Front Bays:

  • Up to 8 x EDSFF E3.S NVMe, max 122.88 TB (FIO config)

  • Up to 16 x EDSFF E3.S Gen5 NVMe, max 245.76 TB

  • Up to 20 x EDSFF E3.S Gen5 NVMe, max 307.2 TB

  • Up to 8 x 2.5″ SAS/SATA/NVMe (Direct/NVMe RAID), max 122.88 TB

  • 8 x 2.5″ Universal, max 245.6 TB

  • Up to 10 x 2.5″ SAS/SATA, max 38.4 TB

• Rear Bays:

  • Up to 2 x EDSFF E3.S Gen5 NVMe, max 30.72 TB

Power Supplies (Hot Swap)

• 1500W Titanium (100–240 VAC / 240 VDC)

• 1100W Titanium (100–240 VAC / 240 VDC)

• 800W Titanium (100–240 VAC / 240 VDC)

• 1100W Platinum (100–240 VAC / 240 VDC)

• 800W Platinum (100–240 VAC / 240 VDC)

• 1800W HLAC Titanium (200–240 VAC / 240 VDC)*

• 1500W (277 VAC / 336 VDC)*

• 1400W LVDC (-48 to -60 VDC)*

Cooling Options

• Air Cooling

• Direct Liquid Cooling (DLC)

Note: DLC is a rack solution and requires rack manifolds and a Cooling Distribution Unit (CDU).

Fans

• High Performance Silver (HPR SLVR) or Standard (STD) fans

• Up to 4 sets of hot-swappable dual fan modules

Dimensions & Weight

• Height: 42.8 mm (1.69 in)

• Width: 482 mm (18.98 in)

• Weight: 20.42 kg (45.02 lbs)

Depth (Rear I/O configuration):

• With bezel: 816.92 mm (32.20 in)

• Without bezel: 815.14 mm (32.09 in)

Depth (Front I/O configuration):

• Without bezel: 829.44 mm (32.66 in)

Note: Front I/O configuration does not support bezel.

Form Factor

• 1U Rack Server

Embedded Management

• iDRAC

• iDRAC Direct

• iDRAC RESTful API with Redfish

• RACADM CLI

• iDRAC Service Module (iSM)

• Quick Sync 2 wireless module

• NativeEdge Endpoint

• NativeEdge Orchestrator

Bezel

• Optional security bezel

Security Features

• Cryptographically signed firmware

• Data-at-Rest Encryption (SEDs with local/external key mgmt)

• Secure Boot

• Secured Component Verification

• Secure Erase

• Silicon Root of Trust

• System Lockdown

• TPM 2.0 (FIPS, CC-TCG certified)

• Chassis Intrusion Detection

Network Options

• 4 x OCP NIC 3.0 cards (optional)

• Supports: 1GbE, 10GbE, 25GbE, 100GbE, 400GbE*

PCIe Slots

• Up to 2 x 16 Gen5 PCIe slots

• Slot 31: 1 x16 Full Height – Half or Full Length or 1 x16 OCP 3.0 (Front Riser)

• Slot 32: 1 x16 Full Height – Half or Full Length or 1 x16 OCP 3.0 (Front Riser)

• Slot 1: 1 x16 Full Height – Half or Full Length or 3 x16 / 1 x8 Low Profile – Half Length

• Slot 2: 1 x16 / 1 x8 Low Profile – Half Length or 1 x16 OCP 3.0

• Slot 4: 1 x16 Full Height – Half Length or Low Profile – Half Length

• BOSS Slot 34: 1 x4 BOSS

• Slot 3: 1 x4 BOSS

• Slot 5: 1 x8 Gen5 OCP 3.0 or 1 x16 Gen5 OCP 3.0

GPU Options

• Up to 3 x 75W single-width GPUs

Ports

Front Ports:

• 1 x USB 2.0 Type-C

• 1 x USB 2.0 Type-A (optional)

• 1 x Mini-DisplayPort (optional)

• 1 x DB9 Serial (with Front I/O config)

• 1 x Dedicated Ethernet port for iDRAC

Rear Ports:

• 1 x Dedicated Ethernet port for iDRAC

• 1 x VGA

• 2 x USB 3.1 Type-A

Internal Ports:

• 1 x USB 3.1 Type-A

Operating Systems & Hypervisors

• Canonical Ubuntu Server LTS

• Microsoft Windows Server with Hyper-V (P-Core only)

• Red Hat Enterprise Linux

• SUSE Linux Enterprise Server

• VMware ESXi

OEM-Ready Version

From bezel to BIOS to packaging, your server can be fully branded for OEM deployment.